Today’s electronic devices, including their IC packages and printed circuit boards (PCBs), have smaller footprints and unique power requirements. Inadequate designs could lead to overheating components that degrade product reliability and cause costly redesigns. Engineers rely on ANSYS Icepak to validate thermal designs and ensure adequate cooling before building hardware.

Icepak provides CFD simulation for electronics thermal management designs. Icepak predicts airflow, temperature and heat transfer in IC packages, printed circuit boards, electronic assemblies/enclosures.

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Icepak

More About Icepak

  • ANSYS Icepak provides powerful electronic cooling solutions which utilize the industry-leading ANSYS Fluent computational fluid dynamics (CFD) solver for thermal and fluid flow analyses of integrated circuits (ICs), packages, printed circuit boards (PCBs) and electronic assemblies.
  • The ANSYS Icepak CFD solver uses the ANSYS Electronics Desktop (AEDT) graphical user interface (GUI). This provides a CAD-centric solution for engineers who can leverage the easy-to-use ribbon interface to manage thermal issues within the same unified framework as ANSYS HFSS, ANSYS Maxwell and ANSYS Q3D Extractor.

Features of Icepak

Electrical and mechanical engineers working in this environment will enjoy a completely automated design flow with seamless coupling from HFSS, Maxwell and Q3D Extractor into Icepak for thermal analysis.
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Enables you to perform advanced thermal and fluid flow analysis for electronic equipment.

Provides advanced, automatic mesh generation optimized for electronic and electromechanical components.

Provides access to a vast library of standard components to quickly build cooling models for analysis.

Lets you easily import MCAD and EDA geometries for an efficient workflow.

Integration with the ANSYS engineering portfolio gives you an unequaled design flow to analyze difficult issues including PCB warping, motor cooling and more.

Powerful toolset lets you visualize 3-D flow animation, velocity vectors, temperature contours and more.