SIwave is a specialized design platform for power integrity, signal integrity and EMI analysis of electronic packages and PCBs. SIwave helps you model, simulate and validate high-speed channels and complete power delivery systems typical in modern high-performance electronics. It accurately extracts multi-gigabit SERDES and memory buses, providing product sign-off compliance for various designs.

SIwave uniquely handles the complexity of interconnect design from die-to- die across ICs, packages, connectors and boards.

SIwave

More About SIwave

  • ANSYS SIwave. Power integrity, signal integrity and EMI. SIwave is a dedicated tool for electrical analysis of full PCB and complex electronic packages. SIwave solves interrelated PI, SI, and EMI challenges to deliver predictive analysis for your design.

Features of SIwave

CFThe software is available in three specialized analysis packages: SIwave-DC, SIwave-PI and SIwave. The products build upon each other, delivering maximum flexibility to equip PCB.

SIwave is available in several packages to provide you the technology to meet your simulation needs.

Provides automatic convergence between electromagnetic PDN analysis and CFD thermal simulation. Automatic data transfer to ANSYS Mechanical identifies premature component failure due to thermal stress.

Adds tremendous value to electromagnetics simulation by enabling large, high-fidelity models that yield accurate and detailed insight into the performance of your design.

Quickly determine if your DDR3/4 bus design will pass or fail Jedec standards.

Provides automatic scanning of PCB or package layout to determine the anticipated impedance Near and Far End crosstalk coefficients.

Enables you to easily and seamlessly import ECAD geometries and materials directly from major EDA layout tools.

Provides a powerful suite of electromagnetics solvers for signal or power analysis.

SIwave’s circuit simulator is fully compatible with IBIS and IBIS-AMI driver/receiver models.

Optimize capacitor placement and reduce cost of PCB and electronic package designs.