Products

Ansys Icepak Cooling
Simulation Software for Electronic Components

Ansys Icepak is a CFD solver for electronics thermal management. It predicts airflow, temperature and heat transfer in IC packages, PCBs, electronic assemblies/enclosures and power electronics.

Overview

Electronics Cooling & PCB Thermal Simulation and Analysis

Ansys Icepak provides powerful electronic cooling solutions that utilize the industry leading Ansys Fluent computational fluid dynamics (CFD) solver for thermal and fluid flow analyses of integrated circuits (ICs), packages, printed circuit boards (PCBs) and electronic assemblies. The Ansys Icepak CFD solver uses the Ansys Electronics Desktop (AEDT) graphical user interface (GUI).

Features

Product Specs

Perform conduction, convection and radiation conjugate heat transfer analyses, with many advanced capabilities to model laminar and turbulent flows, and species analysis including radiation and convection.

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MCAD and ECAD Support

Network Modeling

Liquid Cooling

Solar radiation

DC Joule Heating Analysis

Dynamic Thermal Management

Parametrics and Optimization

Electro-thermal and Thermo-Mechanical

Varying Flow and Power ROM

Customization and Automation

Extensive Libraries for Thermal

Capabilities

Predict airflow, temperature and heat transfer for electronics assemblies and printed circuit boards

With CAD-centric (mechanical and electrical CAD) and multiphysics user interfaces, Icepak facilitates the solving of today’s most challenging thermal management problems in electronics products and assemblies. Icepak uses sophisticated CAD healing, simplification and metal fraction algorithms that reduce simulation times, while providing highly accurate solutions that have been validated against real-world products. The solution’s high degree of accuracy results from the highly automated, advanced meshing and solver schemes, which ensure a true representation of the electronics application.

Capabilities

Structures Capabilities

Icepak includes all modes of heat transfer — conduction, convection and radiation — for steadystate and transient electronics cooling applications.

Electronics Desktop 3D layout GUI
DC joule heating analysis
Multiple-fluid analysis
Reduced order flow and thermal
Thermo-electric cooler modeling
Package characterization
Integrated graphical modeling environment

Electrothermal Analysis of a PCB

Heat can degrade the performance and reliability of electronic devices.

Power dissipation of ICs and power losses across the board are key inputs for thermal analysis.

Electronics Cooling

Ansys’ industry leading computational fluid dynamics (CFD) solutions, along with chip-level thermal integrity simulation software, provide all you need to perform electronics cooling simulation and thermal analysis for chip-package, PCB and systems.

You can also conduct thermomechanical stress analysis and airflow analysis to select the ideal heat sink or fan solution. Our integrated workflow enables you to conduct design trade-offs, resulting in improved reliability and performance.

Thermal Reliability

Tight synergy with SIwave, Ansys Mechanical and Sherlock enables Icepak to accurately predict temperature rise using precise geometries and electrical inputs.

Icepak users can easily assemble automated workflows within the Ansys ecosystem to complete multiphysics analyses for electromigration, dielectric breakdown and multi-axial solder joint fatigue.

RF Systems and Circuits Analysis+

When combined with HFSS, circuits and RF systems simulation technologies create an end-to-end high-performance workflow for RF, EMI/EMC and other applications. It includes EMIT, a unique multi-fidelity approach for predicting RF system performance in complex RF environments with multiple sources of interference. EMIT also provides the diagnostic tools needed to quickly identify root-cause RFI issues and mitigate problems early in the design cycle.

Signal and Power Integrity Analysis+

When combined with HFSS, SI Circuits can be used for analyzing signal integrity, power integrity and EMI issues caused by shrinking timing and noise margins in PCBs, electronic packages, connectors and other complex electronic interconnects.

Signal and Power Integrity Analysis+

HFSS with SI Circuits can handle the complexity of modern interconnect design from die-to-die across ICs, packages, connectors and PCBs. By leveraging the HFSS advanced electromagnetic field simulation capability dynamically linked to powerful circuit and system simulation, engineers can understand the performance of high-speed electronic products long before building a prototype in hardware.