Products

Ansys SIwave
Signal Integrity, Power Integrity, and
EMI Analysis for PCB Design

A specialized tool for power integrity, signal integrity and EMI analysis of IC packages and PCBs. Solves power delivery systems and high-speed channels in electronic devices

Overview

Dedicated PCB & Package Electromagnetics Simulation Software

SIwave helps you model, simulate and validate high-speed channels and complete power delivery systems typical in modern high-performance electronics. It accurately extracts multi-gigabit SERDES and memory buses, providing product sign-off compliance for various designs. SIwave’s full wave extraction of complete power distribution networks (PDN) enables you to verify noise margins and ensure impedance profiles are met through automatic decoupling analysis in low-voltage designs.

Features

Product Specs

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Layout and Geometry Import

Electrothermal Analysis

High-Performance Computing

IBIS and IBIS-AMI SerDes Analysis

Virtual Compliance

Automated Decoupling Capacitor

Impedance and Crosstalk Scanning

Multidomain System Modeling

Electromigration Analysis

EMI Solution

Capabilities

SIwave leverages advanced electromagnetic, thermal and mechanical simulators to dynamically link circuit and system simulation

Successful design of next-generation electronic products requires power integrity, signal integrity and thermal integrity co-analysis. SIwave uniquely handles the complexity of interconnect design from die-to-die across ICs, packages, connectors and boards.

SIwave enables electronics companies to achieve a competitive advantage with faster time to market, reduced costs and improved system performance.

Capabilities

Key Features

SIwave helps you understand the performance of high-speed electronic products long before building a prototype in hardware.

Full-wave SI/PI Extraction

SIwave includes a combination of integrated solvers for fast and accurate SI/PI extraction of complete high-speed PCB and Package design.

There are various extraction types supported by SIwave such as IC packaging RLCG IBIS for signals and power, touch panel RLCG unit cell, bus bar RLCG, power inverter/converter, and a specialized thin-plane solver for touch panel extractions.

Impedance/Crosstalk/EMI scanning

The impedance and crosstalk scanner provide accurate field-solver characteristic impedances and coupling coefficients for traces within PCBs and packages.

EMI Scanner and EMI Xplorer provide automatic and customizable EMI design rule checks to quickly identify areas of potential interference on the design prior to simulation.

Virtual Compliance

SIwave enables you to determine if your design will pass or fail according to specific communication protocol standards.

Ansys SIwave provides a DDR virtual compliance kit which in combination with DDR Wizard provides an end-to-end virtual compliance for designs using DDR technology. Additionally, our new SPISim technology allows for simple compliance reporting for USB-C and COM calculations for IEEE 802.3bj and 802.3bs channels. The programming environment also enables customization and support to add eye masks and limit lines for different type of standards.

Electrothermal and Mechanical Analysis

SIwave links to the Ansys software portfolio for multiphysics simulation of electronic components. One option is to export a power distribution map from SIwave into Ansys Icepak.

This multiphysics solution enables accurate thermal modeling of IC packages and PCBs using DC power loss from SIwave as a heat source. Icepak solves the challenges associated with dissipation of thermal energy from electronic components that may cause premature component failure due to overheating. You can then evaluate thermal stress with Ansys Mechanical. This multiphysics approach enables you to perform coupled EM–thermal–stress analysis for a complete understanding of the design prior to manufacturing.

Signal and Power Integrity Analysis+

When combined with HFSS, SI Circuits can be used for analyzing signal integrity, power integrity and EMI issues caused by shrinking timing and noise margins in PCBs, electronic packages, connectors and other complex electronic interconnects.

Signal and Power Integrity Analysis+

HFSS with SI Circuits can handle the complexity of modern interconnect design from die-to-die across ICs, packages, connectors and PCBs. By leveraging the HFSS advanced electromagnetic field simulation capability dynamically linked to powerful circuit and system simulation, engineers can understand the performance of high-speed electronic products long before building a prototype in hardware.